The situation is good - domestic semiconductor projects are in full swing

As of early June, many domestic cities have achieved good results and progress in semiconductor projects, and many cities have opened a series of investment or industrial upgrading around semiconductors, which will inevitably stimulate the city's economy and industrial chain upgrading.

Kunshan

On June 7, 2023 Kunshan City (Shenzhen) investment promotion Conference was held, during which Xingda semiconductor packaging project signed a contract to settle in Kunshan, Jiangsu. Shenzhen Tongxingda Technology Co., Ltd. plans to cooperate with ASE (Kunshan) Semiconductor Co., Ltd. in Qiandeng Town to invest in the construction of advanced packaging technology Gold Bump (gold bump) sealing test factory, the products are used in integrated circuit packaging technology and external connection of photoelectric components, which is an important part of the integrated circuit industry.

The total investment of all projects is estimated to be 3 billion yuan, of which the total investment of the first phase is 980 million yuan, and the output value after reaching 3.2 billion yuan, of which the output value of the first phase is expected to be 900 million yuan, and the scale of gold bullion production will be in the leading position in the country.

Guangzhou

Today, Guangxin semiconductor packaging substrate product manufacturing project started, the total investment of the project is about 5.8 billion yuan, the land area is about 140,000 square meters, the total construction area is about 380,000 square meters. After the project is put into operation, it is expected that the annual output of semiconductor packaging substrate is 1.5 million PNL, semiconductor high-level flip chip packaging substrate is 20 million, semiconductor multi-chip stack large-size packaging substrate is 1.5 million PNL, and the annual output value will reach 5.6 billion yuan.

Guangzhou Automobile Group Co., LTD. Automotive Engineering Research Institute (referred to as "GAC Research Institute") announced that the 5G V-Box mass production development project will be the first to carry the application of ZTE's car-scale 5G module, and the first carrying model is expected to be mass-produced in 2024. The ZM9300 series of ZTE car-gauge 5G R16 module used in this application is a 5G domestic module product based on the full-stack self-developed chip platform. ZM9300 series products in performance, bandwidth, delay, reliability, NR-V2X, AP high computing power, high precision positioning and other aspects have reached the industry leader; In terms of quality, the module is designed in full compliance with IATF16949:2016 standard, which can provide safe and reliable on-board connectivity solutions for automotive industry customers, and can be widely used in on-board connectivity and other connected products (T-Box, OBU, RSU, cabin, etc.).

Qingdao

According to online news, Qingdao Huaxin wafer third-generation semiconductor compound chip substrate project capped. The project is a key project of Qingdao City, located in the high-tech zone of Qingdao City, north of Kehai Road, south of Keyun Road, east of Planning East Line 22, west of Huaguan Road, construction area of 62,000 square meters.

The project started in February 2022, with a total investment of 700 million yuan, using silicon carbide, gallium nitride, gallium oxide and other third-generation semiconductor compound materials to process and produce related chip substrate products, which are widely used in optoelectronic devices and communication microwave radio frequency devices (4G, 5G communication base stations). After the completion of the project, the production line of 330,000 third-generation compound semiconductor substrate wafers will be achieved annually.

Tianjin

On June 8, the Tianjin production base project of Yuanxu Semiconductor officially started, and the project will create a model case of vertically integrated manufacturing mode of third-generation semiconductor chips. The Tianjin production base project of Yuanxu Semiconductor is equipped with a new third-generation semiconductor optoelectronic chip R&D center and production line, integrating many important industrial chain links such as wafer materials, chip design, chip manufacturing, chip packaging and testing, and will focus on the vertical integration manufacturing of a new generation of Micro-LED semiconductor integrated display. After completion, it will achieve an annual output of 30,000 square meters of Mini/Micro-LED display module production scale, with an annual output value of 1 billion yuan.

Tong Xu

On June 6, the foundation stone of Jiangsu Dongxu Electronic Project was laid. Jiangsu Dongxu Electronics project plans to invest 300 million yuan, land 30 acres, after the completion and production, can form an annual output of 4 million electronic tape, 300,000 semiconductor silicon wafers, 100 sets of AOI inspection equipment production capacity, is expected to achieve an annual output value of 1 billion yuan.