Huawei has obtained an important patent in the field of semiconductor packaging

For a long time, the United States believes that Huawei can be prominent in a short period of time must be the use of American technology, and even after Huawei developed the Kirin 9000S chip, it also sent relevant departments to find evidence, but the investigation so far, the United States has not made any movement.

According to the Financial Street report, Huawei has applied for another patent on "semiconductor packaging" technology. After the news was released, the shares of many companies, including Deppon Technology, soared. It is worth noting that according to the Sky Eye check, the date of Huawei's application for this patent was at the end of October, that is, Huawei already had this technology a few days ago.

It is understood that this semiconductor packaging technology includes a first bottom piece, a semiconductor chip, a lead frame and a sealant. The bottom main surface of the sealant comprises four parts: the first part extends in the first plane, the second part extends in the second plane, the third part extends in the first transition zone, and the fourth part extends in the second transition zone.

Recently, an important patent of Huawei in the field of semiconductor packaging was published. The patent, titled "A packaging method and device for a semiconductor Device," lays the foundation for Huawei's further development in the semiconductor packaging field.

This patent mainly relates to a semiconductor device packaging method and device, which uses advanced packaging technology to effectively improve the reliability and performance of semiconductor devices. Specifically, the patent enables efficient heat conduction and electrical signal transmission by immobilizing and protecting the chip during the packaging process. This packaging method not only improves the performance of the chip, but also enhances the stability and durability of the chip.

Eye check shows that Huawei Technologies Co., Ltd. "semiconductor packaging" patent was published, the application date of publication is October 31, the application publication number is CN116982152A.

The patent abstract indicates that the disclosure relates to a semiconductor package comprising a first substrate, a semiconductor chip, a lead frame, and a sealant. The lower main surface of the sealant includes a first part extended in a first plane, a second part extended in a second plane, a third part extended in a first transition zone between the first plane and the second plane, and a fourth part extended in a second transition zone between the second plane and at least one lead. The first part of the sealant and the lower main face of the first substrate extend in the same first plane, which forms the lower cooling surface of the package. The dimensions of the second part, the third part and the fourth part of the sealant are set to maintain the first predefined minimum distance between the first part of the sealant and the at least one lead.

The publication of the patent is the result of Huawei's continuous efforts in the semiconductor field. As the global semiconductor market becomes more and more competitive, Huawei's investment in semiconductor technology is also increasing. The acquisition of this patent not only provides a strong proof of Huawei's technical strength in the field of semiconductor packaging, but also provides important support for Huawei's development in the future semiconductor market.

In addition, the packaging methods and devices involved in the patent also provide new development ideas for other industries. For example, in the automotive, aerospace, medical and other fields, the patented technology can be applied to the packaging of various semiconductor devices, thereby improving the reliability and performance of electronic devices in these fields.

In general, Huawei's patent is of great significance in the field of semiconductor packaging. It not only provides technical support for the development of Huawei, but also provides new ideas for the development of other industries. In the future, we look forward to seeing the application and development of this technology in more areas.