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About Us
Company Profile
Corporate Culture
Organizational Structure
Development History
Honor and qualification
Products
Image Chip Packaging
MIPI/DVP Camera Module
USB Camera Module
3D Camera Module
Other Camera Modules
Image and Video Solution
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R & D Capabilities
Production Capabilities
Quality Capabilities
Application Scenarios
News
Technology
Message
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Contact Us
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发布时间 : 2022-03-11
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It is rumored that Samsung Exynos 2400 will be packaged in I-Cube, GPU performance will exceed Snapdragon 8 Gen3
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