TSMC US plant introduces first EUV

According to Taiwan media reports, TSMC Arizona plant in the United States has officially introduced the local first set of extreme ultraviolet light (EUV) micro image exposure equipment. As the construction of the plant enters the critical stage of installing advanced and precision equipment, local TSMC suppliers are also continuing to recruit employees. According to statistics, it is estimated that there are still about 2,000 vacancies for related equipment installation engineers.

According to the plan, TSMC is expected to invest in the establishment of two advanced fabs in Arizona. Among them, the first wafer fab expected to use 4 nm process technology has completed the hardware construction and is currently installing thousands of advanced and precision equipment, including the plant's first EUV microimage exposure equipment, which is expected to begin formal mass production in 2025. In addition, the construction of the next second wafer fab, which is expected to use a 3-nanometer process, is also well underway and is expected to be completed in 2027.

At present, in order to build the plant's needs, TSMC Arizona plant currently has about 12,000 plant construction personnel on site. In the process of advancing to the equipment installation stage, in order to meet the needs of equipment installation, the supplier is also recruiting about 2,000 local engineering personnel, including sheet metal, electricians and other related engineering personnel.

TSMC said it is committed to working with its suppliers to create local jobs while providing an inclusive working environment and striving to build a sustainable supply chain. In response to previous reports of labor problems in Arizona, the United States, TSMC has said that it will work with suppliers to create local jobs, but also to further provide an inclusive working environment, and strive to establish a sustainable supply chain.