Huawei has obtained an important patent in the field of semiconductor packaging

For a long time, the United States believes that H···

Qualcomm's new generation of Snapdragon 8 Gen 3 processor specifications exposed: CPU speed increased by 30%

Semiconductor world October 23 news, Qualcomm is a···

IBM's new chip architecture points to faster, more energy-efficient artificial intelligence

A new chip prototype from IBM's research lab i···

Oufei light even closed three daily limit, the main supply Huawei Mate 60 series is just the tipping point

In the recent capital market, the performance of O···

Peer volume customer pressure, China's filter industry survival is urgent

This is a good season for the shipment of "go···

Selling more than 4 billion chips, Jerry launched its fourth IPO

As the wearable industry continues to warm up, Zhu···

South Korean factories began shutting down lithography machines

On August 25, due to the lack of demand in the sem···

Semiconductor companies are cutting bonuses

According to Taiwan media reports, many semiconduc···

TSMC US plant introduces first EUV

According to Taiwan media reports, TSMC Arizona pl···